EDUCATION DESIRED: Ph.D. in Material Science, Physics, Physical Chemistry, or related scientific discipline.
ESSENTIAL JOB FUNCTIONS: Lead innovation and development of novel 2.5D and 3D fabrication, packaging, and assembly processes for dense high speed electronics applications, with attention to all facets of this endeavor (e.g. RF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability / cost constraints, etc.). Perform first-principles analyses of candidate approaches. Organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above). Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Organize and present results, in written reports, journal papers, and oral presentations. Create and manage work plans to meet or exceed schedule deadlines and technical expectations. Lead and contribute to proposal and marketing efforts required to sustain continued R&D efforts.
EXPERIENCE DESIRED: More than 15 years of experience in developing, characterizing, and exercising semiconductor manufacturing processes and corresponding electronics packaging. More than 15 years of experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process tools and techniques. Experience with a wide range of semiconductor processing technology (e.g. metal evaporation and plating, photolithography, PECVD) and assembly techniques (e.g. wafer bonding, die bonding, microbump flip-attach, wirebonding). More than 10 years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding. Familiarity with commercial packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) would be a plus.
KNOWLEDGE DESIRED: Deep understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques. Familiarity with high speed electrical characterization methods. Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
SPECIAL REQUIREMENTS (e.g. driver’s license, special tools or restrictions): U.S. citizenship is required. Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
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