EDUCATION DESIRED: Bachelor’s or Master’s Degree in Electrical Engineering, Physics, or related scientific discipline with minimum 7 years of related experience
ESSENTIAL JOB FUNCTIONS: Work in an integrated team of scientists and engineers to design, integrate, and troubleshoot leading-edge high dynamic range (>80 dB), high frequency (from RF to mmW) mixed signal systems involving novel architectures and algorithms, customized integrated circuits (ICs) and printed circuit boards (PCBs), and aggressive packaging and integration techniques. Working with other team members responsible for system and component design and analysis (electrical, thermal, mechanical, etc.), create and manage interface control documents (ICDs), requirements documents, and other related information (e.g. detailed netlists and BOMs for printed circuit board and package development) required to support integrated system development. Work with design and assembly teams to ensure components and subsystems are constructed in a manner consistent with these requirements. Work with integration and test teams to develop test protocols, perform measurement analysis against requirements, and modify requirements as needed for subsequent design iterations. Interface with internal HRL staff and outside vendors to support design, fabrication, assembly, and testing as needed. Present details of work to colleagues during design reviews. Create and manage work plans to meet or exceed schedule deadlines. Provide written and oral summaries of work performed as needed for reports.
EXPERIENCE DESIRED: At least 5 years’ experience with architecture, design, fabrication, integration, and analysis of complex mixed signal systems (e.g. RADAR, LIDAR, communications, electronic attack, electronic support, etc.), including testing and troubleshooting of complex integrated systems. Experience with development of ICDs and requirements documents. Familiar with high frequency mixed signal component design, packaging, procurement, and testing. Experience with common high frequency electronic test techniques and equipment (VNA, TDR, real-time and sampling oscilloscopes, spectrum analysis, etc.). Must have excellent organization and communication skills. Familiarity with RF design practices (e.g. controlled impedance transmission lines, crosstalk minimization, signal integrity, power integrity, electromagnetic simulations), thermal/mechanical design considerations, and/or 3D CAD design tools (e.g. Solidworks) would be a plus.
KNOWLEDGE DESIRED: Must have good working knowledge of fundamental high speed electrical engineering principles (e.g. frequency and time domain transforms, S-parameters and other network analysis techniques, controlled impedance, etc.) and circuit design principles (e.g. LCR circuits, filter theory, amplifier and oscillator design theory including phase/gain stability, etc.). Familiarity with microelectronics packaging and integration fabrication processes and associated materials properties. Familiarity with custom mixed signal integrated circuit design flow. Knowledge of fundamental microelectronic packaging test procedures and equipment (particularly RF measurements such as VNA and TDR). Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
SPECIAL REQUIREMENTS: U.S. citizenship is required. Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
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