EDUCATION DESIRED: Bachelor’s Degree in Electrical Engineering, Mechanical Engineering, Physics, or related scientific discipline with minimum 2 years of related experience
ESSENTIAL JOB FUNCTIONS: Work with engineering and research staff to design and subsequently perform layout of advanced electronic integration materials such as high density interconnect printed circuit boards (PCBs), multilayer ceramic and organic single-chip and multi-chip packages, and interposers for high frequency (>1 GHz) applications. Survey potential external fabrication vendors and explore internal HRL processes to quantitatively evaluate different packaging alternatives. Support package component development (e.g. stackup analysis, schematic design, layout, thermal-mechanical analysis, release for fabrication, acceptance testing, assembly). Work closely with other domain experts performing related functional design and analyses (e.g. circuit design, signal integrity / power integrity analysis, etc.). Select and procure supporting active and passive component such as connectors, capacitors, resistors, switches, power regulators, performing necessary design engineering to aid in selection. Interface with internal HRL staff and outside vendors to support design, fabrication, assembly, and testing as needed. Present details of work to colleagues during design reviews. Create and manage work plans to meet or exceed schedule deadlines. Provide written and oral summaries of work performed as needed for reports.
EXPERIENCE DESIRED: Experience with design and layout using printed circuit board / multilayer package design tools such as Mentor Graphics Xpedition or PADS, Altium Designer, or Cadence Allegro and/or including advanced features such as use of blind / buried vias and other advanced padstacks, differential routing, delay matching, embedded passives. Experience with specification of PCB stackups, materials (including high performance laminates), and finishes (HASL, ENIG, ENEPIG, etc.) to support a variety of assembly techniques including mixed assembly (e.g. both soldered and wirebonded components). Experience working with commercial packaging vendors. Familiarity with RF design practices (e.g. controlled impedance transmission lines, crosstalk minimization, signal integrity, power integrity, electromagnetic simulations), thermal/mechanical design considerations, and/or 3D CAD design tools (e.g. Solidworks) would be a plus.
KNOWLEDGE DESIRED: Familiarity with microelectronics packaging and integration fabrication processes and associated materials properties. Knowledge of fundamental electrical engineering and circuit design principles. Knowledge of fundamental microelectronic packaging test procedures and equipment (particularly RF measurements such as VNA and TDR). Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
SPECIAL REQUIREMENTS: U.S. citizenship is required. Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
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